The company's solid state cooling device - called AirJet. Learn how AirJet works & the benefits of solid state cooling in devices.
Future of cooling? https://youtu.be/YGxTnGEAx3E
Able to produce 10x more back pressure than a traditional thin notebook fan thermal cooling solution, it is able to suck air through IP68 dust filters
This technology made using semiconductor MEMS technology developed by Texas Instruments originally to make the membrane flexing that produces the amazing functionality possible in a tiny thin form factor that combines a copper heat spreader with the flexing membrane to pump heat with high static pressure by sucking cool air into the device & shoving it at high velocity tangentially with jet impingement to break through the boundary layer on the copper spreader to efficiently transfer heat from the copper to the cooling air shoved out of the small aperture thin rectangular ejection port to push heat out of the device, especially useful in tablet computers, smartphones, laptops & other thin form factor compute that requires active cooling for higher performance.
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